Remainders of paste and adhesive are never particularly aesthetic. They may even prove to be real operating saboteurs with wafer-thin SMD stencils because they hinder the ever shorter set-up times and flexible production cycles required today.
Here, too, LTC has the proper recipe: the surface treatment LTC-Polish. It makes the stencil surface extremely smooth and improves printing quality. Pastes and adhesives can be removed easier and cleaner. The backside part of the stencil does not have to be cleaned so often any longer. In contrast to electro polishing, LTC-Polish accurately maintains stencil thickness and opening widths so that the stencil corresponds to the original data.
- Better removal behavior of the paste
- Fewer cleaning cycles when printing
- Thousandfold proven
- Applicable for all stencil types
